DSP MCM
Description:
This is a Digital Signal Processing Multi-Chip Module which was designed and
developed by the University of Tennessee.
It measures 37 mm by 37 mm (MCM-D) and contains a 32-bit floating point DSP,
128K SRAM, 64K FLASH, 10K FPGA, and 6-channel ADC.
We believe that this is the most complex, least expensive MCM that
has been designed and implemented by a university team to date.
The project won First Place in the 1996 Mentor Graphics PCB/MCM Design Contest.
Slides
Publications
Contributors:
Applied Computing Technology, Inc.: Original designer's spinoff company.
Chip Supply Inc.: Provided the SRAM and FLASH bare dies.
DARPA: Project sponsor
Mentor Graphics Corp.: Provided MCM CAD Tool
MOSIS IC/MIDAS MCM Broker: IC and MCM Broker
MicroModule Systems, Inc.: MCM Foundry
Motorola Inc.: Provided the DSP bare dies
Oak Ridge National Lab.: Provided the ADC bare dies
University of Tennessee: Leading contractor to DARPA
Xilinx, Inc.: Provided Xilinx FPGA dies